Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders

Journal of Materials Research

Volumn 24, Issue 2, 2009, Pages 534-543

  Cho, Moon Gi ^a   Kang, Sung K ^b   Seo, Sun Kyoung ^a   Shih, Da Yuan ^b   Lee, Hyuck Mo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING ELEMENTS; BRAZING; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; DISSOLUTION; LEAD; NICKEL; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; TIN ALLOYS; UNDERCOOLING; WELDING;

BENEFICIAL EFFECTS; COMPETING MECHANISMS; COMPOSITIONAL CHANGES; INTERMETALLIC COMPOUNDS; NI ATOMS; NI-DOPED; PB-FREE SOLDERS; SN-BASED SOLDERS; SOLDER ALLOYS; SOLDER COMPOSITIONS; SOLDER MATRIXES; THERMODYNAMIC CALCULATIONS; UNDER BUMP METALLIZATION; UNDER-BUMP METALLURGIES;

TIN;

EID: 61749085682     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2009.0046     Document Type: Article

References (22)

1. S.K. Kang, P. Lauro, D.-Y. Shih, D.W. Henderson, and K.J. Puttlitz: The microstructure, solidification, mechanical properties, and thermal fatigue behavior of lead (Pb)-free solders and solder joints used in microelectronic applications. IBM J. Res. Dev. 49(4/5), 607 (2005).
2. B. Vonnegut: Variation with temperature of the nucleation rate of supercooled liquid tin and water drops. J. Colloid Sci. 3, 563 (1948).
3. G.M. Pound and V.K.L.A. Mer: Kinetics of crystalline nucleus formation in supercooled liquid tin. J. Am. Chem. Soc. 74, 2323 (1952).
4. 3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition, in Proc. 53rd Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2003), pp. 64-70.
5. L.P. Lehman, R.K. Kinyanjui, L. Zavalij, A. Zribi, and E.J. Cotts: Growth and selection of intermetallic species in Sn-Ag-Cu, No-Pb, solder systems based on pad metallurgies and thermal histories, in Proc. 53rd Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2003), pp. 1215-1221.
6. 3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying. JOM 56(6), 34 (2004).
7. Q. Xiao, L. Nguyen, and W.D. Armstrong: The anomalous micro-structural, tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder. J. Electron. Mater. 34(5), 617 (2005).
8. M.G. Cho, S.K. Kang, and H.M. Lee: Undercooling and micro-hardness of Pb-free solders on various under bump metallurgies. J. Mater. Res. 23(4), 1147 (2008).
9. S.K. Kang, M.G. Cho, P. Lauro, and D-Y. Shih: Critical factors affecting the undercooling of Pb-free, flip-chip solder bumps and in-situ observation of solidification process, in Proc. 57th Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2007), pp. 1597-1603.
10. S.K. Kang, M.G. Cho, D-Y. Shih, S-K. Seo, and H.M. Lee: Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders, in Proc. 58th Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2008), pp. 478-484.
11. C.E. Ho, S.C. Yang, and C.R. Kao: Interfacial reaction issues for lead-free electronic solders. J. Mater. Sci.-Mater. Electron. 18, 155 (2007).
12. S-W. Chen and C-H. Wang: Interfacial reactions of Sn-Cu/Ni couples at 250 °C. J. Mater. Res. 21(9), 2270 (2006).
13. B. Sundman, B. Jansson, and J.O. Andersson: The Thermo-Calc databank system. Calphad 9, 153 (1985).
14. G. Ghosh: Thermodynamic modeling of the nickel-lead-tin system. Metall. Mater. Trans. A 30, 1481 (1999).
15. 4 grains at Sn-3.5Ag/Ni joint. J. Electron. Mater. 32(11), 1228 (2003).
16. W.K. Choi and H.M. Lee: Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate. Scr. Mater. 46(11), 777 (2002).
17. K. Zeng, V. Vuorinen, and J.K. Kivilahti: Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards. IEEE Trans. Electron. Packag. Manuf. 25, 162 (2002).
18. T. Laurila, V. Vuorinen, and J.K. Kivilahti: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng., R 49, 1 (2005).
19. K. Zeng and K.N. Tu: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng., R 38, 55 (2002).
20. Binary Alloy Phase Diagrams, edited by T.B. Massalski (ASM International, Metal Park, OH, 1990), p. 1481.
21. K-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker: Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys. J. Electron. Mater. 29, 1122 (2000).
22. P. Nash and A. Nash: The Ni-Sn system. Bull. Alloy Phase Diag. 6, 350 (1985).