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Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 32-39

The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi

(6) Ventura, Tina a Gourlay, Christopher M a Nogita, Kazuhiro a Nishimura, Tetsuro b Rappaz, Michel c Dahle, Arne K a

a UNIVERSITY OF QUEENSLAND (Australia)

b School of Materials Engineering (Japan)

c Bioengineering Institute (Switzerland)

Author keywords

Eutectic; Fluidity; Lead free soldering; Nickel; Sn Cu alloys; Solidification

Indexed keywords

LEAD-FREE SOLDERING; NICKEL CONTENT; RAGONE METHODS;

EUTECTICS; MICROSTRUCTURE; SOLIDIFICATION; SYNCHROTRON RADIATION;

SOLDERING ALLOYS;

EID: 37249000886 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-007-0281-7 Document Type: Article

Times cited : (69)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.