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Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics

Volumn , Issue , 2007, Pages 55-76

Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications

(1) Anderson, Iver E a

a IOWA STATE UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84892816750 PISSN: None EISSN: None Source Type: Book
DOI: 10.1007/978-0-387-48433-4_4 Document Type: Chapter

Times cited : (42)

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