Lead-free flip chip interconnect reliability for DCA and FC-PBGA packages

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 642-649

  Lin, Jong Kai ^a   Jang, Jin Wook ^a   Hayes, Scott ^a   Frear, Darrel ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP INTERCONNECTS; SILICON CHIPS; SOLDER BUMPS; UNDER BUMP METALLURGY (UBM);

CHIP SCALE PACKAGES; DEFORMATION; INTERMETALLICS; STRESS ANALYSIS; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

FLIP CHIP DEVICES;

EID: 10444257177     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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