The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 922-929

  Lu, Minhua ^a   Shih, Da Yuan ^a   Lauro, Paul ^a   Kang, Sung ^a   Goldsmith, Charles ^b   Seo, Sun Kyoung ^c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

PB FREE SOLDERS; RAPID DIFFUSION; SN GRAINS; SN-AG SOLDER; SN-CU SOLDERS; SOLDER MICROSTRUCTURE; SYSTEMATIC STUDY; ZN DOPING;

ALLOYING; ALLOYING ELEMENTS; LEAD; MICROSTRUCTURE; SILVER; SOLDERING ALLOYS; ZINC;

TIN;

EID: 70349372637     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074123     Document Type: Conference Paper

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