Impact reliability of solder joints

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 668-674

  Date, M ^a   Shoji, T ^b   Fujiyoshi, M ^b   Sato, K ^b   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b HITACHI CABLE LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATED FLUX; BALL GRID ARRAY (BGA); SHEAR TEST; SOLDER BUMPS;

ENERGY DISPERSIVE SPECTROSCOPY; FRACTURE TOUGHNESS; GOLD; HARDENING; MELTING; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; STRENGTH OF MATERIALS; THERMAL EFFECTS; TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 10444246545     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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