Characterization of solder joint electromigration for flip chip technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 816-821

  Lin, Jong Kai ^a   Jang, Jin Wook ^a   White, Jerry ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRIC CURRENTS; ELECTRIC RESISTANCE; ELECTROMIGRATION; EUTECTICS; MATERIALS TESTING; MICROSTRUCTURE; PHASE SEPARATION; SOLDERED JOINTS; STRESSES; TIN ALLOYS;

ELECTROMIGRATION TESTING; FLIP CHIP CONFIGURATION; FLIP CHIP TECHNOLOGY; SOLDER JOINT ELECTROMIGRATION;

FLIP CHIP DEVICES;

EID: 0038012578     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. W. J. Choi, E.C.C. Yeh, and K.N. Tu, "Electromigration of Flip Chip Solder Bump on Cu/Ni(V)/Al thin Film Under Bump Metallurg", 52nd ECTC conf., Sec.29, paper No.2, (2002).
2. H. Gan and K.N. Tu, "Effect of Electromigration on Intermetallic Compound Formation in Pb-Free Solder - Cu Interface, 52nd ECTC conf., Sec.29, paper No.3, (2002).
3. D. Gupta, K. Vieregge, and W. Gust, "Interface diffusion in eutectic Pb-Sn solder," Acta Mater. 47, p.5 (1999).
4. S. Brandenburg and S. Yeh, "Electromigration study of flip chip bump solder joint", Surface Mount International Conference & Exposition, p327 (1998).
5. K.N. Tu, C.C. Yeh, C.Y. Liu, and Chih Chen, "Effect of current crowding on vacancy diffusion and void formation in electromigration", Appl. Phys. Letter, 76, p.988 (2000).