Undercooling and microhardness of Pb-free solders on various under bump metallurgies

Journal of Materials Research

Volumn 23, Issue 4, 2008, Pages 1147-1154

  Cho, Moon Gi ^a   Kang, Sung K ^b   Lee, Hyuck Mo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATED PRODUCTS; INTERMETALLICS; MICROHARDNESS; MICROSTRUCTURAL EVOLUTION; SURFACE CHEMISTRY; UNDERCOOLING;

MICROSTRUCTURAL CHANGES; UNDER BUMP METALLURGIES;

SOLDERING ALLOYS;

EID: 42949177464     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0133     Document Type: Article

References (22)

1. J. Bath, C. Handwerker, and E. Bradley: Research update: Lead-free solder alternatives. Circuits Assem. 11, 31 (2000).
2. I.E. Anderson, J.C. Foley, B.A. Cook, J. Harringa, R.K. Terpatra, and O. Unal: Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability. J. Electron. Mater. 30, 1050 (2001).
3. K.J. Puttlitz: Sn-Ag and Sn-Ag-X solders and properties, in Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, edited by K.J. Puttlitz and K.A. Stalter (Marcel Dekker, New York, 2004), pp. 239-280.
4. S.W. Jeong, J.H. Kim, and H.M. Lee: Effect of cooling rate on growth of IMC and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging. J. Electron. Mater. 33, 1530 (2004).
5. S.K. Kang, P. Lauro, D-Y. Shih, D.W. Henderson, and K.J. Puttlitz: The microstructure, solidification, mechanical properties, and thermal fatigue behavior of lead (Pb)-free solders and solder joints used in microelectronic applications. IBM J. Res. Dev. 49, 606 (2005).
6. B. Vonnegut: Variation with temperature of the nucleation rate of supercooled liquid tin and water drops. J. Colloid Sci. 3, 563 (1948).
7. G.M. Pound and V.K.L.A. Mer: Kinetics of crystalline nucleus formation in supercooled liquid tin. J. Am. Chem. Soc. 74, 2323 (1952).
8. 3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition, in Proc. 53rd Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2003), pp. 64-70.
9. L.P. Lehman, R.K. Kinyanjui, L. Zavalij, A. Zribi, and E.J. Cotts: Growth and selection of intermetallic species in Sn-Ag-Cu no-Pb solder systems based on pad metallurgies and thermal histories, in Proc. 53rd Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2003), pp. 1215-1221.
10. 3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying. JOM 56(6), 34 (2004).
11. R. Kinyanjui, L.P. Lehman, L. Zavalij, and E. Cotts: Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys. J. Mater. Res. 20, 2914 (2005).
12. S.K. Kang, M.G. Cho, P. Lauro, and D-Y. Shih: Critical factors affecting the undercooling of Pb-free, flip-chip solder solder bumps and in-situ observation of solidification process, in Proc. 57th Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2007), pp. 1597-1603.
13. S.K. Kang, M.G. Cho, P. Lauro, and D-Y. Shih: Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process. J. Mater. Res. 22, 557 (2007).
14. Q. Xiao, L. Nguyen, and W.D. Armstrong: The anomalous microstructural, tensile, and aging response of thin-cast Sn3.9Ag0.6Cu lead-free solder. J. Electron. Mater. 34, 617 (2005).
15. K.S. Kim, S.H. Huh, and K. Suganuma: Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. Microelectron. Reliab. 43, 259 (2002).
16. I. de Sousa, D.W. Henderson, L. Party, S.K. Kang, and D-Y. Shih: The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures, in Proc. 56th Electronic Components and Technology Conference (IEEE, Piscataway, NJ, 2006), pp. 1454-1461.
17. S-W. Chen and C-C. Huang: The relationship between the peak shape of a DTA curve and the shape of a phase diagram. Chem. Eng. Sci. 50, 417 (1995).
18. S-W. Chen, C-C. Lin, and C-M. Chen: Determination of the melting and solidification characteristics of solders using differential scanning calorimetry. Metall. Mater. Trans. A 29, 1965 (1998).
19. Y-D. Jeon, S. Nieland, A. Ostmann, H. Reichl, and K-W. Paik: A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy. J. Electron. Mater. 32, 548 (2003).
20. M.G. Cho, K.W. Paik, H.M. Lee, S.W. Booh, and T.G. Kim: Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging. J. Electron. Mater. 35, 35 (2006).
21. C.E. Ho, S.C. Yang, and C.R. Kao: Interfacial reaction issues for lead-free electronic solders. J. Mater. Sci. Mater. Electron. 18, 155 (2007).
22. S-W. Chen and C-H. Wang: Interfacial reactions of Sn-Cu/Ni couples at 250°C. J. Mater. Res. 21, 2270 (2006).