Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

JOM

Volumn 62, Issue 7, 2010, Pages 22-29

  Seo, Sun Kyoung ^a   Kang, Sung K ^b   Cho, Moon Gi ^a   Lee, Hyuck Mo ^c  

^a SAMSUNG Electronics   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COLUMNAR GRAIN; FOUR-GROUP; HIGH CURRENT DENSITIES; IMC LAYER; INTERFACIAL INTERMETALLICS; LARGE-GRAIN; LOW ANGLE GRAIN BOUNDARIES; PB FREE SOLDERS; SOLDER COMPOSITION; SOLDER JOINTS; UNDER BUMP METALLIZATION;

ELECTROMIGRATION; GRAIN BOUNDARIES; INTERMETALLICS; JOINING; LEAD; MICROSTRUCTURE; SILVER; SOLDERING ALLOYS;

TIN;

EID: 77956944829     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-010-0104-9     Document Type: Article

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