Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 83-88

  Sohn, Yoon Chul ^a   Yu, Jin ^a   Kang, Sung K ^b   Shih, Da Yuan ^b   Lee, Taek Yeong ^c  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c Hanbat National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD; MECHANICAL TESTING; METALLIZING; NICKEL; PHOSPHORUS; SPALLING; TIN;

FRACTURE SURFACES; INTERMETALLIC SPALLING; PB-FREE SOLDERS; SOLDER INTERCONNECTION;

SOLDERED JOINTS;

EID: 24644446070     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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