SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 146-153

Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates

(7) Kang, S K a Choi, W K a Shih, D Y a Lauro, P a Henderson, D W b Gosselin, T b Leonard, D N b

a IBM T J WATSON RESEARCH CENTER (United States)

b IBM MICROELECTRONICS (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); INTERMETALLICS; LAMINATES; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TERNARY SYSTEMS; WAVELENGTH DISPERSIVE SPECTROSCOPY;

X-RAY FLUORESCENCE;

MICROELECTRONICS;

EID: 0036287155 PISSN: 05695503 EISSN: None Source Type: Journal
DOI: 10.1109/ECTC.2002.1008088 Document Type: Article

Times cited : (50)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.