The effect of Ni on the interfacial reaction between Sn-Ag solder and Cu metallization

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 271-275

  Tsai, J Y ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; LEAD; LEAD-FREE SOLDERS; METALLIZING; MICROELECTRONICS; MODIFIED ATMOSPHERE PACKAGING; NICKEL; PACKAGING MATERIALS; SILVER; SOLDERING; SOLDERING ALLOYS; SUBSTRATES;

CU METALLIZATION; DIFFUSION CONTROLLED; ELECTRONIC COMPONENT; ELECTRONIC PRODUCT; INTERMETALLIC THICKNESS; MICROELECTRONICS INDUSTRY; PRINT CIRCUIT BOARDS; SN-3.5AG SOLDERS;

TIN;

EID: 84966628872     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188849     Document Type: Conference Paper

References (4)

1. J. Glazer, Int. Mater. Rev., 40, p. 65, 1995.
2. A.Rahn, The Basics Of Soldering, 1998.
3. P. T. Viano, Circuit Word, 25/1, p.6, 1998.
4. C. E. Ho, Y. L. Lin and C. R. Kao, Chemistry of Materials, vol. 14, n. 3, march 2002.