An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 257-265

  Seo, Sun Kyoung ^a   Kang, Sung K ^b   Shih, Da Yuan ^b   Lee, Hyuck Mo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Cooling rate; Microhardness; Microstructure; Sn grain; Sn Ag; Sn Cu

Indexed keywords

AIR COOLING; ALLOY COMPOSITIONS; COOLING RATE; CRITICAL FACTORS; CROSS POLARIZATIONS; FURNACE COOLING; GRAIN SIZES; INTERMETALLIC COMPOUNDS; LIGHT MICROSCOPIES; SN GRAIN; SN-AG; SN-CU; TWIN BOUNDARIES;

ALLOYING; ALLOYS; BRAZING; CHEMICAL ANALYSIS; COOLING; COPPER; COPPER ALLOYS; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CRYSTALLIZATION; FREEZING; GRAIN SIZE AND SHAPE; INTERMETALLICS; LIGHT; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; RAPID SOLIDIFICATION; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS; WELDING;

TIN;

EID: 58349107241     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0545-x     Document Type: Article

References (21)

1. S.K. Kang A.K. Sarkhel 1994 J. Electron. Mater. 23 701 10.1007/BF02651362
2. S.W. Jeong J.H. Kim H.M. Lee 2004 J. Electron. Mater. 33 1530 10.1007/s11664-004-0095-9
3. S.K. Kang, W.K. Choi, D.-Y. Shih, D.W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith, and K.J. Puttlitz, Proc. 53rd Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2003), pp. 64-70.
4. S.K. Kang W.K. Choi D.-Y. Shih D.W. Henderson T. Gosselin A. Sarkhel C. Goldsmith K.J. Puttlitz 2003 JOM 55 61 10.1007/s11837-003-0143-6
5. E. Laine, E. Perfecto, B. Campbell, J. Wood, J. Busby, J. Garant, and L. Guerin, Proc. 57th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2007), pp. 1320-1325.
6. S. Ishikawa, T. Uchiyama, E. Hashino, T. Kohno, M. Tanaka, and K. Tatsumi, Proc. 57th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2007), pp. 872-877.
7. D. Kim, D. Suh, T. Millard, H. Kim, C. Kumar, M. Zhu, and Y. Xu, Proc. 57th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2007), pp. 1614-1619.
8. M. Uchida, H. Ito, K. Yabui, H. Nishiuchi, T. Togasaki, K. Higuchi, and H. Ezawa, Proc. 57th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2007), pp. 885-891.
9. T.R. Bieler, H. Jiang, L.P. Lehman, T. Kirkpatrick, and E.J. Cotts, Proc. 56th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2006), pp. 1462-1467.
10. D.W. Henderson J.J. Woods T.A. Gosselin J. Bartelo D.E. King T.M. Korhonen M.A. Korhonen L.P. Lehman E.J. Cotts S.K. Kang P. Lauro D.-Y. Shih C. Goldsmith K.J. Puttlitz 2004 J. Mater. Res. 19 1608 10.1557/JMR.2004.0222
11. L.P. Lehman S.N. Athavale T.Z. Fullem A.C. Giamis R.K. Kinyanjui M. Lowenstein K. Mather R. Patel D. Rae J. Wang Y. Xing L. Zavalij P. Borgensen E.J. Cotts 2004 J. Electron. Mater. 33 1429 10.1007/s11664-004-0083-0
12. A. Lalonde D. Emelander J. Jeannette C. Larson W. Rietz D. Swenson D.W. Henderson 2004 J. Electron. Mater. 33 1545 10.1007/s11664-004-0096-8
13. B. Sundman B. Jansson J.O. Andersson 1985 Calphad 9 153 10.1016/0364-5916(85)90021-5
14. U.R. Kattner W.J. Boettinger 1994 J. Electron. Mater. 23 603 10.1007/BF02653345
15. J.-H. Shim C.-S. Oh B.-J. Lee D.N. Lee 1996 Z. Metallk. 87 205
16. G. Ghosh, Metab. Mater. Trans. A 30A, 1481 (1999). doi: 10.1007/s11661-999-0085-x.
17. A.U. Telang T.R. Bieler J.P. Lucas K.N. Subramanian L.P. Lehman Y. Xing E.J. Cotts 2004 J. Electron. Mater. 33 1412 10.1007/s11664-004-0081-2
18. S.K. Kang, M.G. Cho, P. Lauro, D.-Y. Shih, Proc. 57th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2007), pp. 1597-1603.
19. M.G. Cho S.K. Kang H.M. Lee 2008 J. Mater. Res. 23 1147 10.1557/jmr.2008.0133
20. S.K. Kang, M.G. Cho, D.-Y. Shih, S.-K. Seo, and H.M. Lee, Proc. 58th Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2008), pp. 478-484.
21. H.-J. Albrecht, A. Juritza, K. Muller, W.H. Muller, J. Sterthaus, J. Villain, and A. Vogliano, Proc. 5th Electronics Packaging Technology Conf. (Piscataway, NJ: IEEE, 2003), pp. 726-731.