Microstructure and mechanical properties of new lead-free solder

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1329-1333

  Ninomiya, Ryuji ^a   Miyake, Koichi ^a   Matsunaga, Junichi ^a  

^a MITSUI MINING AND SMELTING CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844401359     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (9)

1. Glazer, J., 1994, "Microstructure and Mechanical Properties of Pb-Free Solder Alloys for Low-Cost Electronic Assembly: A Review, J. Electronic Materials, Vol.23, 693-699
2. Jin, S., 1993, "Developing Lead-Free Solders: A Challenge and Opportunity", JOM, Vol.45, No.7, 13
3. Kang, S. K. and Sarkhel, A. K., 1994, "Lead(Pb)-Free Solders for Electronic Packaging", J. Electronic Materials, Vol.23, 701-707
4. McCormack, M. and Tin, S., 1993, "Progress in the Design of New Lead-Free Solder Alloys", JOM, Vol.45, No.7, 36-40
5. Ninomiya, R. et al.: The 19th Meeting of Soldering Sub-commitee, Committee of Microjoining, Japan Welding Society, Tokyo (1995) MJS-100-95, 27-34
6. Ninomiya, R. and Matsunaga, J., Japan Kokai Tokko Koho (in Japanese), JP 96-187590
7. Takemoto, T. et al.: The 19th Meeting of Soldering Sub-commitee, Committee of Microjoining, Japan Welding Society, Tokyo (1995) MJS-98-95, 9-16
8. Winterbottom, W. L., 1993, "Converting to Lead-Free Solders: An Automotive Industry Perspective", JOM, Vol.45, No.7, 20-24
9. Wood, E. P. and Nimmo, K. L., 1994, "In Search of Lead-Free Electronic Solders", J. Electronic Materials, Vol.23, 709-713