Effect of Pb free alloy composition on drop/impact reliability of 0.4, 0.5 & 0.8mm pitch chip scale packages with NiAu pad finish

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 951-956

  Syed, Ahmer ^a   Kim, Tae Seong ^b   Cha, Se Woong ^b   Scanion, Joan ^a   Ryu, Chang Gyun ^b  

^a AMKOR TECHNOLOGY   (United States)

^b Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; GOLD ALLOYS; LEAD ALLOYS; NICKEL ALLOYS; RELIABILITY; SOLDERING;

DROP PERFORMANCE; IMPACT RELIABILITY; PB FREE ALLOY COMPOSITION; SAC ALLOYS;

CHIP SCALE PACKAGES;

EID: 35348903144     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373911     Document Type: Conference Paper

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