Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 675-682

  Paik, Kyung Wook ^a   Jeon, Young Doo ^a   Cho, Moon Gi ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; HEAT TREATMENT; INTERFACES (MATERIALS); INTERMETALLICS; LEAD; NICKEL ALLOYS; SUBSTITUTION REACTIONS; THERMAL EFFECTS;

FLIP-CHIP BUMPING; INTERFACIAL REACTION; SOLDER BUMPS;

SOLDERING ALLOYS;

EID: 10444256200     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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