Kirkendall voids at Cu/solder interface and their effects on solder joint reliability

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 415-420

  Mei, Zequn ^a   Ahmad, Mudasir ^a   Hu, Mason ^a   Ramakrishna, Gnyaneshwar ^a  

^a CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SHOCK STRENGTH; SOLDER INTERFACES; SOLDER MASKS; VOID DENSITY;

COPPER; NICKEL; RESINS; STRENGTH OF MATERIALS; SUBSTRATES; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 24644438312     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K.N. Tu, "Impact Reliability of Solder Joints," Proceeding of 2004 Electronic Component and Technology Conference, pp. 668-674.
3. W. Yang and R.W. Messler, Jr., "Microstructure Evolution of Eutectic Sn-Ag Solder Joints," J. Electron. Mater., Vol. 23, No. 8, (1994), pp. 765-772.
4. S. Ahat, M. Sheng, and L. Luo, "Microstructure and Shear Strength Evolution of SnAg/Cu Surface Mount Solder Joint During Aging," J Electron. Mater., Vol. 30, No. 10, (2001), pp. 1317-1332.
5. D. Goyal, T. Lane, P. Kinzie, and C. Panichas, K. Chong, O. Villalobos, "Failure Mechanism of Brittle Solder Joint Fracture in the Presence of Electroless Nickel Immersion Gold (ENIG) Interface," Proceeding of 2002 Electronic Component and Technology Conference.
6. Wolfgang Riedel, Electroless Nickel Plating, ASM International, Metals Pack, Ohio, 1991, p. 95.
7. Mechanical Test Specification of Interconnect, Cisco Systems, 2004.