Physical and electrical characteristics of silver-copper nanopaste as alternative die-attach

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 4, Issue 1, 2014, Pages 8-15

  Tan, Kim Seah ^a   Cheong, Kuan Yew ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

Die attach; Interconnect; Nanoscale particles; Rheology; Sintering

Indexed keywords

ATOMIC FORCE MICROSCOPY; NANOPARTICLES; RHEOLOGY; SCANNING ELECTRON MICROSCOPY; SILVER; SINTERING; X RAY DIFFRACTION;

AG AND CU NANOPARTICLES; DIE-ATTACH; DIE-ATTACH MATERIALS; ELECTRICAL CHARACTERISTIC; ELECTRICAL CONDUCTIVITY; HIGH-TEMPERATURE DIE-ATTACH; INTERCONNECT; NANOSCALE PARTICLES;

ELECTRIC PROPERTIES;

EID: 84892413281     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2285128     Document Type: Article

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