Transient liquid phase die attach for high-temperature silicon carbide power devices

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 3, 2010, Pages 563-570

  Mustain, Habib A ^a   Brown, William D ^b   Ang, Simon S ^b  

^a TRUMPF Photonics   (United States)

^b University of Arkansas   (United States)

Author keywords

Silicon carbide die attach; transient liquid phase bonding

Indexed keywords

AG-IN ALLOYS; ALLOY SYSTEM; BONDING INTERFACES; DIE ATTACH; DIE ATTACH TECHNIQUES; HIGH TEMPERATURE; INTERMETALLIC PHASIS; OPERATING TEMPERATURE; PULL STRENGTH; SILICON CARBIDE DIE-ATTACH; SILICON-CARBIDE POWER DEVICES; THERMAL-ANNEALING; TRANSIENT LIQUID PHASE; TRANSIENT LIQUID PHASE BONDING; VOID-FREE;

ANNEALING; CARBIDE DIES; ELECTRIC EQUIPMENT; LIQUIDS; PHASE INTERFACES; SILICON ALLOYS; SILICON CARBIDE; SILVER; STAINLESS STEEL; SUBSTRATES;

SILVER ALLOYS;

EID: 77957778805     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2010.2046901     Document Type: Article

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