Effect of sintering temperature on silver-copper nanopaste as high temperature die attach material

Advanced Materials Research

Volumn 795, Issue , 2013, Pages 47-50

  Tan, Kim Seah ^a   Cheong, Kuan Yew ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

Coper; Die attach; High temperature applications; Lead free solder; Silver; Sintering

Indexed keywords

COPER; DIE-ATTACH; ELECTRICAL CONDUCTIVITY; HIGH-TEMPERATURE DIE-ATTACH; LEAD FREE SOLDERS; ORGANIC BINDERS; SHEAR-THINNING BEHAVIOR; SINTERING TEMPERATURES;

COPPER COMPOUNDS; HIGH TEMPERATURE APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SILVER; X RAY DIFFRACTION;

SINTERING;

EID: 84886252344     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.795.47     Document Type: Conference Paper

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