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Volumn 30, Issue 4, 2007, Pages 241-245

Processing and characterization of nanosilver pastes for die-attaching SiC devices

Author keywords

Semiconductor device packaging; Semiconductor devices bonding; Silver

Indexed keywords

ADHESIVE PASTES; CARBIDE DIES; ENERGY GAP; NANOSTRUCTURED MATERIALS; SILICON CARBIDE; SILVER; SUBSTRATES;

EID: 35348849542     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.906508     Document Type: Article
Times cited : (135)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.