Thermal cycling analysis of high temperature die-attach materials

Microelectronics Reliability

Volumn 52, Issue 9-10, 2012, Pages 2314-2320

  Navarro, L A ^a   Perpina X ^a   Vellvehi, M ^a   Banu, V ^a   Jorda X ^a  

^a UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYSIS TOOLS; DIE-ATTACH MATERIALS; FINITE ELEMENTS SIMULATION; HIGH TEMPERATURE; PACKAGING ASSEMBLIES; TEST VEHICLE; THERMO-MECHANICAL;

CERIUM ALLOYS;

THERMAL CYCLING;

EID: 84866740156     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.07.022     Document Type: Article

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