Gold-indium transient liquid phase (TLP) wafer bonding for MEMS vacuum packaging

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2008, Pages 806-809

  Welch III, Warren C ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; GOLD; INDIUM; LIQUID PHASE EPITAXY; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; PRESSURE MEASUREMENT; REACTIVE ION ETCHING; THICKNESS MEASUREMENT; VACUUM;

INTERNAL PRESSURES; INTERNATIONAL CONFERENCES; LEAK RATES; MICRO-ELECTRO MECHANICAL SYSTEMS; TRANSIENT LIQUID PHASE; VACUUM ENVIRONMENT; VACUUM PACKAGING; WAFER LEVELS; WORST CASE;

WAFER BONDING;

EID: 47249118157     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2008.4443779     Document Type: Conference Paper

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