Recent development of nano-solder paste for electronics interconnect applications

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 84-93

  Liu, Johan ^a,b   Andersson, Cristina ^a   Gao, Yulai ^b   Zhai, Qijie ^b  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; APPLICATIONS; BRAZING; ELECTRONICS PACKAGING; MELTING POINT; METAL MELTING; MICROMETERS; NANOPARTICLES; OPTICAL PROPERTIES; SOLDERING ALLOYS; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACE TENSION; TECHNOLOGY TRANSFER; THICKNESS MEASUREMENT; WELDING;

COMPOSITE SOLDERS; ELECTRONIC APPLICATIONS; FINE-PITCH APPLICATIONS; GENERAL APPLICATIONS; HIGH DENSITIES; HIGH MELTING; INTERCONNECT APPLICATIONS; INTERCONNECT MATERIALS; LARGE SURFACE AREAS; LEAD-FREE SOLDERS; MANUFACTURING PROCESS; MECHANICAL AND PHYSICAL PROPERTIES; MELTING TEMPERATURES; MICROMETER RANGES; NANO METER RANGES; NANO-REINFORCEMENTS; NANOMETER SIZE RANGES; PER UNIT VOLUMES; QUANTUM SIZE EFFECTS; SELF PURIFICATIONS; SOLDER ALLOYS; SOLDER PASTES; SURFACE ENERGIES; TECHNOLOGICAL COMMUNITIES; ULTRA SMALLS;

LEAD;

EID: 63049100635     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763416     Document Type: Conference Paper

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