Characterization of low-temperature sintered nanoscale silver paste for attaching semiconductor devices

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Volumn , Issue , 2005, Pages

  Bai, J G ^a,b   Zhang, Z Z ^a,b   Calata, J N ^a,b   Lu, G Q ^a,b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONNECTORS; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; HEAT LOSSES; RELIABILITY; THERMAL EXPANSION;

ORGANIC BINDER SYSTEMS; ULTRASONIC AGITATION;

SEMICONDUCTOR DEVICES;

EID: 42749108296     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2005.251412     Document Type: Conference Paper

References (21)

1. Tummala, R. R., et al, Microelectronics Packaging Handbook: Semiconductor Packaging, Part II, Eds. Chapman & Hall (New York, 1997), pp. 285-293.
2. Neudeck, P. G., Okojie, R. S., and Chen, L. Y., Proc. "High-temperature electronics - A role for wide bandgap semiconductors?" Proc. IEEE 90, (2002), pp. 1065-1076.
3. Cooper, J. A., and Agarwal, A., "SiC power-switching devices - The second electronics revolution?" Proc. IEEE 90, (2002), pp. 956-968.
4. Khan, M. A. et al, "GaN based heterostructure for high power devices," Solid- State Electron. 41, (1997), pp. 1555-1559.
5. Endriz, J. G. et al, "High-power diode-laser arrays", IEEE J. Quantum Electron. 28, (1992), pp. 952-965.
6. Katz, A., Lee, C. H., and Tai, K. L., "Advanced metallization schemes for bonding of InP-based laser devices to CVD-diamond heatsinks," Mat. Chem. Phys. 37, (1994), pp. 303-328.
7. Tessmer, A. J., Plano, L. S., and Dreifus, D. L., "High-temperature operation of polycrystalline diamond field-effect transistors," IEEE Electron. Dev. Lett. 14, (1993), pp. 66-68.
8. Kim, H. K., Liou, H. K., and Tu, K. N., "Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu," Appl. Phys. Lett. 66, (1995), pp. 2337-2339.
9. Rane, S., Puri, V., and Amalnerkar, D., "A study on sintering and microstructure development of fritless silver thick film conductors," J. Mater. Sci. - Mater. Electron. 11, (2000), pp. 667-674.
10. Chang, C. R., and Jean, J. H., "Effects of silver-paste formulation on camber development during the cofiring of a silver-based, low-temperature-cofired ceramic package," J. Am. Cer. Soc. 81, (1998), pp. 2805-2814.
11. Zhang, Z., and Lu, G. Q., "Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow", IEEE Trans. Electron. Pack. Manu., 25, (2002), pp. 279-283.
12. Schwarzbauer, H., "Method of securing electronic components to a substrate," U.S. Patent 4 810 672.
13. Schwarzbauer, H., and Kuhnert, R., "Novel large area joining technique for improved power device performance, IEEE Trans. Ind. Appl. 27, (1991), pp. 93-95.
14. Chuang, R. W., and Lee, C. C., "Silver-indium joints produced at low temperature for high temperature devices," IEEE Trans. Comp. Pack. Tech. 25, (2002), pp. 453-458.
15. Groza, J. R., and Zavaliangos, A., "Nanostructured bulk solids by field activated sintering," Rev. Adv. Mater. Sci. 5, (2003), pp. 24-33.
16. Groza, J. R., "Nanosintering," NanoStruct. Mater. 12, pp. 987-992, 1999.
17. th IEEE CPMT International Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, Shanghai, PR China, June 30- July 3, 2004.
18. Parker, W. J., Jenkins, R. J., Butler, C. P., and Abbott, G. L., "Flash method of determining thermal diffusivity, heat capacity, and thermal conductivity," J. of Appl. Phys. 32, (1961), pp. 1679-1684.
19. Hasselman, D. P. H., and Donaldson, K. Y., "Effects of detector nonlinearity and specimen size on the apparent thermal-diffusivity of NIST-8425 graphite," Inter. J. of Thermophys. 11, (1990), pp. 573-585.
20. Choe, J., Calata, J. N., and Lu, G. Q., "Constrained-film sintering of a gold circuit paste," J. Mater. Res. 10 (1995), pp. 986-994.
21. Levin, V. A., Lokhin, V. V., and Zingerman, K. M., "Effective elastic properties of porous materials with randomly dispersed pores: finite deformation", J. Appl. Mech. 67 (2000), pp. 667-670.