Silver glues and lead-free alloys in die attach of power devices

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 363-366

  Gobbato, Livio ^a   Scandurra, Antonino ^b   Tong, Yan Tee ^c  

^a STMICROELECTRONICS   (Italy)

^b Laboratorio Superfici e Interfasi SUPERLAB   (Italy)

^c STMICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CONSUMER ELECTRONICS; DIES; ELECTRIC POWER SYSTEMS; REGULATORY COMPLIANCE; RISK ASSESSMENT; SILVER; THERMAL EFFECTS;

CONSUMER PRESSURE; DIE BONDING; PEAK TEMPERATURE;

SOLDERING ALLOYS;

EID: 33847320707     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. th European Microelectronics Conference Proc., 1997, pp. 308-319.
2. IPC/JEDEC J-STD 020C specifications.
3. Tschudin, C., Hutin, O., Arsalane, S., Bartels, F., Lambracht, P., Rettenmayr, M., "Lead Free Soft Solder Die Attach Process for Power Semiconductor Packaging", Proc. of Semicon Shangai, March 2002.