Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use

Journal of Electronic Materials

Volumn 28, Issue 11, 1999, Pages 1172-1175

  Shimizu, T ^a   Ishikawa, H ^a   Ohnuma, I ^b   Ishida, K ^b  

^a SUMITOMO METAL MINING CO LTD   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; DIES; GOLD PLATING; SILVER PLATING; STRESS RELAXATION; ZINC ALLOYS;

DIE-ATTACHING;

SOLDERING ALLOYS;

EID: 0033221457     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0153-4     Document Type: Article

References (5)

1. Lead Free Solder Project, Final Report, NCMS Report 0401RE96 (Ann Arbor, MI: National Center for Manufacturing Sciences, August 1997).
2. G. Petzow, G. Effenberg, eds., Ternary Alloys - A Comprehensive Compendium of Evaluated Constitutional Data and Phase Diagrams, vol. 5, (Weinheim, Germany: VCH Verlagsgesellschaft, 1992).
3. G. Petzow, G. Effenberg, eds., Ternary Alloys - A Comprehensive Compendium of Evaluated Constitutional Data and Phase Diagrams, vol 6, (Weinheim, Germany: VCH Verlagsgesellschaft, 1993).
4. T.B. Massalski, ed., Binary Alloys Phase Diagrams, Second Edition (Materials Park, OH: ASM International, 1990).
5. O. Devillers and O. Niessen, Corrosion Science 16, 243 (1976).