High-conductivity adhesive for light-emitting diode die-attachment by low-temperature sintering of micrometer-sized Ag particles

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 6, 2012, Pages 909-915

  Kunimune, Teppei ^a   Kuramoto, Masafumi ^a   Ogawa, Satoru ^a   Niwa, Miki ^b   Nogi, Masaya ^c   Suganuma, Katsuaki ^c  

^a NICHIA CORPORATION   (Japan)

^b UNIVERSITY OF TOKUSHIMA   (Japan)

^c OSAKA UNIVERSITY   (Japan)

Author keywords

Bonding; light emitting diodes; silver

Indexed keywords

AG PARTICLES; ATMOSPHERIC CONDITIONS; BONDING LAYERS; CONDUCTIVE ADHESIVE; INTERNAL BONDING; LOW-TEMPERATURE PROCESS; LOW-TEMPERATURE SINTERING; MELTED POLYMERS; PLASTIC SUBSTRATES; POLYMER PARTICLES; SPECIFIC RESISTANCES;

BONDING; DIES; DIODES; LIGHT EMITTING DIODES; MICROMETERS; ORGANIC SOLVENTS; POLYMERS; SINTERING; TEMPERATURE;

SILVER;

EID: 84861947409     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2188292     Document Type: Article

References (7)

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