Nonlinear viscoelastic characteristics of Sn-Ag-Cu solder pastes used in electronics assembly applications

Journal of Materials Engineering and Performance

Volumn 22, Issue 4, 2013, Pages 1186-1193

  Mallik, Sabuj ^a   Chan, Erica Hiu Laam ^b   Ekere, Ndy ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

nonlinear flow; rheology; solder paste; suspension; viscoelasticity

Indexed keywords

ELECTRONIC ASSEMBLIES; ELECTRONICS ASSEMBLY; NONLINEAR FLOW; NONLINEAR VISCO-ELASTIC; NONLINEAR VISCOELASTIC BEHAVIORS; RHEOLOGICAL BEHAVIORS; SOLDER PASTE; VISCOELASTIC PROPERTIES;

ELASTICITY; PARTICLE SIZE ANALYSIS; RHEOLOGY; SILVER; SUSPENSIONS (FLUIDS); TESTING; TIN; VISCOELASTICITY; VISCOSITY;

SOLDERING ALLOYS;

EID: 84876497616     PISSN: 10599495     EISSN: 15441024     Source Type: Journal    
DOI: 10.1007/s11665-012-0360-7     Document Type: Article

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