Rheological characterisation and empirical modelling of lead-free solder pastes and isotropic conductive adhesive pastes

Journal of ASTM International

Volumn 7, Issue 7, 2010, Pages

  Durairaj, R ^a   Man, Lam Wai ^a   Ramesh, S ^a  

^a UNIVERSITI TUNKU ABDUL RAHMAN   (Malaysia)

Author keywords

Cross model; Power law model; Rheology; Stencil printing process

Indexed keywords

CHARACTERISATION; CROSS MODEL; ELECTRONIC INDUSTRIES; ELECTRONIC MANUFACTURING INDUSTRY; EMPIRICAL MODEL; EMPIRICAL MODELLING; EXPERIMENTAL DATA; FLIP CHIP ASSEMBLIES; FLOW BEHAVIORS; ISOTROPIC CONDUCTIVE ADHESIVES; LEAD-FREE SOLDER PASTE; PASTE PRINTING PROCESS; POWER LAW; POWER LAW MODEL; QUALITATIVE BEHAVIOR; SHEAR RATES; SHEAR-RATE DEPENDENCE; SOLDER PASTE; STENCIL PRINTING; STENCIL PRINTING PROCESS;

CHIP SCALE PACKAGES; DROP FORMATION; ELASTICITY; ELECTRONIC EQUIPMENT MANUFACTURE; PRINTING; PRINTING PRESSES; RHEOLOGY; SHEAR DEFORMATION; VISCOMETERS; VISCOSITY;

ADHESIVE PASTES;

EID: 77955840316     PISSN: None     EISSN: 1546962X     Source Type: Journal    
DOI: 10.1520/JAI103009     Document Type: Article

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