Reliability of sintered Ag80-Al20 die attach nanopaste for high temperature applications on SiC power devices

Microelectronics Reliability

Volumn 53, Issue 3, 2013, Pages 473-480

  Manikam, Vemal Raja ^a   Razak, Khairunisak Abdul ^a   Cheong, Kuan Yew ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

DIE-ATTACH; DIE-ATTACH MATERIALS; ELECTRICAL CONDUCTIVITY; ELECTRICAL PERFORMANCE; MICROPORES; ORGANICS; POWER DEVICES;

ALUMINUM; ELECTRIC CONDUCTIVITY; ELECTRIC EQUIPMENT; HIGH TEMPERATURE APPLICATIONS; HIGH TEMPERATURE OPERATIONS; RELIABILITY ANALYSIS; SILICON CARBIDE; SINTERING; THERMAL AGING;

SILVER;

EID: 84874662384     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.10.007     Document Type: Article

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