SCOPUS 정보 검색 플랫폼

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 288-294

Novel conductive adhesives for surface mount applications

(2) Daoqiang, Lu a Wong, C P a

a GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; BINARY ALLOYS; BOND STRENGTH (MATERIALS); FLEXIBLE ELECTRONICS; GLASS TRANSITION; INTERFACES (MATERIALS); LEAD ALLOYS; MOISTURE; PACKAGING MATERIALS; SURFACE MOUNT TECHNOLOGY; TIN ALLOYS;

BULK RESISTIVITY; CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; FLEXIBLE PRINTED CIRCUIT; JOINT RESISTANCE; MOISTURE ABSORPTION; SHEAR ADHESION STRENGTHS; SURFACE MOUNT COMPONENTS;

EPOXY RESINS;

EID: 84878016462 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ISAPM.1999.757328 Document Type: Conference Paper

Times cited : (11)

References (8)

1
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- Jagt, P. J. M. Beris, and G. F. C. M. Lijten, "Electrically Conductive Adhesives: A Prospective Alternative for SMD Soldering ?", IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 18, no. 2, p. 292,1995.
- (1995) IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol.18 , Issue.2 , pp. 292
- Jagt, P.J.M.B.¹ Lijten, G.F.C.M.²

2
- 0343572126
- Applications for electrically conductive adhesives in SMT
- Ralf Luchs, "Applications for Electrically Conductive Adhesives in SMT", Proceedings of Adhesives'96, p. 76, 1996.
- (1996) Proceedings of Adhesives , vol.96 , pp. 76
- Luchs, R.¹

3
- 0003108721
- Electrically conductive adhesives for surface mount solder replacement
- M. Zwolinski, J. Hickman, H. Rubin, and Y. Zaks, "Electrically Conductive Adhesives for Surface Mount Solder Replacement", Proceedings of Adhesives'96, p. 333, 1996.
- (1996) Proceedings of Adhesives , vol.96 , pp. 333
- Zwolinski, M.¹ Hickman, J.² Rubin, H.³ Zaks, Y.⁴

4
- 0032090243
- Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art
- J.C. Jagt, "Reliability of Electrically Conductive Adhesive Joints for Surface Mount Applications: A Summary of the State of the Art", IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 21, no. 2, p. 215,1998.
- (1998) IEEE Transactions on Components, Packaging, and Manufacturing Technology , vol.21 , Issue.2 , pp. 215
- Jagt, J.C.¹

5
- 0343323527
- Conductive adhesives as a soldering alternative
- November
- B.T. Alphert and A.J. Schoenberg, "Conductive Adhesives as a Soldering Alternative", Electronic Packaging and Production, p. 130, November, 1991.
- (1991) Electronic Packaging and Production , pp. 130
- Alphert, B.T.¹ Schoenberg, A.J.²

6
- 0031361004
- A fundamental study of electrically conductive adhesives
- C.P. Wong, D. Lu, S. Von-, and Q. Tong, "A Fundamental Study of Electrically Conductive Adhesives", Proceedings of the 1997 1st IEEE International Symposium on Polymeric Electronics Packaging, p.80,1997
- Proceedings of the 1997 1st IEEE International Symposium on Polymeric Electronics Packaging , vol.1997 , pp. 80
- Wong, C.P.¹ Lu, D.² Von, S.³ Tong, Q.⁴

7
- 0022760138
- Adhesives that possess a science all their own
- August
- L. Smith-Vargo, "Adhesives That Possess a Science All Their Own", Electronic Packaging and Production, p. 48, August, 1986.
- (1986) Electronic Packaging and Production , pp. 48
- Smith-Vargo, L.¹

8
- 85037070709
- Moisture sorption in some popular conductive adhesives: What really happens?
- C.G.L. Khoo and J. Liu, "Moisture Sorption in Some Popular Conductive Adhesives: What Really Happens?", Proceedings of Adhesives'96, p. 395, 1996.
- (1996) Proceedings of Adhesives , vol.96 , pp. 395
- Khoo, C.G.L.¹ Liu, J.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.