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Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 38, Issue 6, 2007, Pages 1371-1375

Thermal and tensile properties of Bi-Ag alloys

(3) Song, Jenn Ming a Chuang, Hsin Yi a Wen, Tien Xiang a

a NATIONAL DONG HWA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD-FREE SOLDER; MICROSTRUCTURAL CHARACTERISTICS;

ELONGATION; HIGH TEMPERATURE APPLICATIONS; METALLOGRAPHIC MICROSTRUCTURE; SOLDERING ALLOYS; SOLIDIFICATION; STRAIN RATE; TENSILE STRENGTH; THERMODYNAMIC PROPERTIES;

BISMUTH ALLOYS;

EID: 34447626116 PISSN: 10735623 EISSN: None Source Type: Journal
DOI: 10.1007/s11661-007-9138-1 Document Type: Article

Times cited : (94)

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