Microstructural stability of Ag sinter joining in thermal cycling

Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 4, 2013, Pages 1332-1340

  Sakamoto, Soichi ^a   Sugahara, Tohru ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH-POWER SEMICONDUCTOR DEVICES; JOINING MATERIALS; JOINING STRENGTH; LOW TEMPERATURES; MICROSTRUCTURAL STABILITY; TEMPERATURE RANGE; THERMAL FATIGUE CRACKS; ULTRAHIGH TEMPERATURE;

HIGH TEMPERATURE OPERATIONS; JOINING; SINTERING; THERMAL CYCLING;

SILVER;

EID: 84876469577     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-012-0929-9     Document Type: Article

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