Study on the curing process and shearing tests of die attachment by Ag-epoxy electrically conductive adhesive

International Journal of Adhesion and Adhesives

Volumn 30, Issue 2, 2010, Pages 80-88

  Guan, Youliang ^a   Chen, Xu ^a   Li, Fengqin ^a   Gao, Hong ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Durability; Electrically conductive adhesive; Hygrothermal aging; Shearing test; Silver filled epoxy; Thermal cycling

Indexed keywords

ADHESIVE STRENGTH; BASE METALS; CU SUBSTRATE; CURING PROCESS; DIE ATTACHMENT; DIFFERENT PROCESS; ELECTRICALLY CONDUCTIVE ADHESIVES; HEATING AND COOLING RATES; HYGROTHERMAL AGING; PLATING LAYER; SHEARING TEST; SHEARING TESTS;

COOLING; DIES; DURABILITY; SHEAR STRENGTH; SHEARING; TESTING; THERMAL CYCLING;

SILVER;

EID: 71649099949     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2009.09.003     Document Type: Article

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