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Volumn , Issue , 2012, Pages 231-237

Thermocompression bonding of Ag-MWCNTs nanocomposite films as an alternative die-attach solution for high temperature packaging of SiC devices

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED FORCES; BONDING TECHNOLOGY; CHIP-LEVEL; DIE SHEAR TEST; DIE-ATTACH MATERIALS; FLIP-CHIP BONDING; HANDLING CAPABILITY; HIGH TEMPERATURE; HIGH-TEMPERATURE ENVIRONMENT; HIGH-TEMPERATURE PACKAGING; JOINT STRENGTH; MIL STANDARD; PACKAGING SOLUTIONS; PB SOLDERS; POWER DENSITIES; SIC DEVICES; SIC SCHOTTKY DIODE; THERMAL AGING TESTS; THERMO COMPRESSION BONDING; THERMO MECHANICAL FATIGUES (TMF); THERMO-COMPRESSION; WIDE BAND-GAP MATERIAL;

EID: 84866842107     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248833     Document Type: Conference Paper
Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.