Investigations on Zn-Al-Ge alloys as high temperature die attach material

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Haque, A ^a   Won, Y S ^b   Haseeb, A S M A ^a   Masjuki, H H ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

^b Package Innovation and Development Center   (Malaysia)

Author keywords

Cu substrate; Die attach; High temperature solder; Interfacial reaction; Lead free; Zn Al alloy

Indexed keywords

CU SUBSTRATE; DIE ATTACH; HIGH TEMPERATURE; INTERFACIAL REACTIONS; LEAD-FREE; ZNAL ALLOY;

ALUMINUM; COPPER COMPOUNDS; DIES; GERMANIUM; INTERMETALLICS; LEAD; MICROSCOPES; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SILICON; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; WETTING; ZINC; ZINC ALLOYS;

TIN;

EID: 78651275118     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5643009     Document Type: Conference Paper

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