High-temperature lead-free solders: Properties and possibilities

JOM

Volumn 61, Issue 1, 2009, Pages 64-71

  Suganuma, Katsuaki ^a   Kim, Seong Jun ^a   Kim, Keun Soo ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVE; EPOXY ADHESIVES; HIGH TEMPERATURE; INTERCONNECTION TECHNOLOGY; LEAD FREE SOLDERS; LEAD SOLDERS; LEAD-FREE; LEAD-FREE ASSEMBLY; STEP-BY-STEP;

ALLOYS; BISMUTH; BISMUTH ALLOYS; BRAZING; CONDUCTIVE MATERIALS; EPOXY RESINS; SILVER; TIN; TIN ALLOYS; WELDING; ZINC;

LEAD;

EID: 67649429462     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-009-0013-y     Document Type: Review

References (29)

1. K. Suganuma, Curr. Opin. Solid State Mater. Sci., 5 (1) (2001), pp. 55-64.
2. K.N. Tu, A.M. Gusak, and M. Li, J. Appl. Phys., 93 (2003), pp. 1335-1352.
3. J.H. Kim, S.W. Jeong, and H.M. Lee, Mater. Trans., 43 (2002), pp. 1873-1878.
4. S.F. Corbin, J. Electron. Mater., 34 (2005), pp. 1016-1025.
5. M. Rettenmayr, P. Lambracht, and B. Kempf, Adv. Engineer. Mater., 7 (2005), pp. 965-969.
6. E. Gervais, R.J. Barnhurst, and C.A. Loong, J. Metals, 37(11) (1985), pp. 43-47.
7. F. Cay and C. Kurnaz, Mater. Design, 26 (2005), pp. 479-485.
8. M. Rettenmayr et al., J. Electron. Mater., 31 (2002), pp. 278-285.
9. N. Kang et al., J. Alloys Comp., (2008), doi:10.1016/ j.jallcom.2007.12.048.
10. T. Shimuzu et al., J. Electron. Mater., 28 (1999), pp. 1172-1175.
11. S.J. Kim et al., Mater. Trans., 49 (2008), pp. 1531-1536.
12. K. Suganuma, J.-E. Lee, and K.-S. Kim, "Zn-Sn and Zn-In High Temperature Lead-Free Solders" (Presentation at the 2007 MRS Spring Meeting Symposium E: Pb-Free and RoHS-Compliant Materials and Processes for Microelectronics, San Francisco, April 11-12, 2007).
13. J.E. Lee et al., Mater. Trans., 46 (2005), pp. 2413-2418.
14. J.E. Lee et al., Mater. Trans., 48 (2007), pp. 584-593.
15. S.J. Kim et al., J. Electron. Mater. (2008), doi: 10.1007/ s11664-008-0550-0.
16. S. Motojima and H. Mizutani, J. Mater. Sci., 23 (1988), pp. 3435-3439.
17. S.-J. Kim et al., "Interfacial Reactions of Die Attached AlN-DBC Module Using Zn-Sn High Temperature Solders" (Presentation at the TMS 2008 Annual Meeting & Exhibition, New Orleans, March 10-14, 2008).
18. K. Suganuma et al., J. Mater. Res., 13 (1998), pp. 2859-2865.
19. M. Ueshima, private communication (March 24, 2008).
20. J.M. Song, H.Y. Chuang, and Z.M. Wu, J. Electron. Mater., 35 (2006), pp. 1041-1048.
21. K. Suganuma, Polymer and Adhesives in Microelectronics and Photonics (Piscataway, NJ: IEEE, 2007), pp. 30-35.
22. J.N. Lalena, N.F. Dean, and M.W. Weiser, J. Electron. Mater., 31 (2002), pp. 1244-1249.
23. Yi Li and C.P. Wong, Mater. Sci. Engineer. R., 51 (1-3) (2006), pp. 1-35.
24. T. Tashiro, private communication (March 24, 2008).
25. M. Vuorela et al, Proc. 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 2000 (Piscataway, NJ: IEEE, 2000), pp. 147-152.
26. H.G. Song, J.W. Morris, and M.T. McCormack, J. Electron. Mater., 29 (2000), pp. 1038-1046.
27. J.Y. Tsai et al., J. Electron. Mater., 35 (1) (2006), pp. 65-71.
28. J.W. Yoon et al., J. Mater. Res., 22 (10) (2007), pp. 2817-2824.
29. J.W. Yoon, H.S. Chun, and S.B. Jung, J. Mater. Res., 22 (5) (2007), pp. 1219-1229.