Emerging lead-free, high-temperature die-attach technology enabled by low-temperature sintering of nanoscale silver pastes

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 461-466

  Lu, Guo Quan ^a   Zhao, Meihua ^a   Lei, Guangyin ^a   Calata, Jesus N ^a   Chen, Xu ^b   Luo, Susan ^c  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b TIANJIN UNIVERSITY   (China)

^c NBE Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE POWER ELECTRONICS; CHIP AREAS; CHIP JUNCTIONS; DIE-ATTACH APPLICATIONS; HIGH-TEMPERATURE DIE-ATTACH; HIGHER TEMPERATURES; JOINING TECHNOLOGY; LEAD-FREE; LOW TEMPERATURES; LOW-TEMPERATURE SINTERING; NANOSCALE SILVER PASTE; POWER ELECTRONICS MODULES; QUASI-STATIC PRESSURE; ROHS COMPLIANCE; SILVER PASTES; SINTERING TEMPERATURES; THERMOMECHANICAL PROPERTIES;

AUTOMOBILE ELECTRONIC EQUIPMENT; CHIP SCALE PACKAGES; DIES; JOINING; MECHANICAL PROPERTIES; NANOSTRUCTURED MATERIALS; ORGANIC POLYMERS; PACKAGING; POWER ELECTRONICS; SINTERING; SOLDERING; TECHNOLOGY;

SILVER;

EID: 70449846183     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270709     Document Type: Conference Paper

References (13)

1. Scheuermann, U., and P. Beckedahl, "The Road to the Next Generation Power Module - 100% Solder free Design," in The 5th International Conference on Integrated Power Electronics Systems (CIPS 2008), 2008, Nuremberg, Germany.
2. Schulze, E., C. Mertens, and A. Lindemann, "Low Temperature Joining Technique - a Solution for Automotive Power Electronics," in PCIM, 2009, Nurnberg, Germany.
3. Mertens C., J.R., and R. Sittig, "Top-side Contacts with LTJT," in the 35th Annual IEEE Power Electronics Specialists Conference, 2004, Aachen, Germany.
4. Bai, J.G., Z. Z. Zhang, J. N. Calata, and G-Q. Lu, "Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material," IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3 (2006), pp. 589-593.
5. Bai, J.G., and G-Q. Lu, "Thermomechanical Reliability of Low-Temperature Sintered Silver Die-Attached SiC Power Device Assembly," IEEE Trans. on Device and Materials Reliability,Vol. 6, No. 3 (2006), pp. 436-441.
6. Calata, J.N., T. G. Lei, and G-Q. Lu, "Sintered nanosilver paste for high-temperature power semiconductor device attachment," Int. J. Materials and Product Technology, Vol. 34, No. 1/2 (2009), pp. 95-110.
7. G.-Q. Lu, J.N. Calata, G. Lei, and X. Chen, "Low-temperature and Pressureless Sintering Technology for High-performance and High-temperature Interconnection of Semiconductor Devices," in 8th International Conference on Thermal, Mechanical, and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSime 2007, 2007, London, UK, IEEE.
8. G.-Q. Lu, J.N. Calata, and T.G. Lei, "Low-temperature sintering of nanoscale silver paste for power chip attachment," in the 5th International Conference on Integrated Power Electronics Systems (CIPS'08), 2008, Nuremberg, Germany.
9. Wang, T., X. Chen, G-Q. Lu, and G-Y. Lei, "Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection," Journal of Electronic Materials, Vol. 36, No. 10 (2007), pp. 1333-1340.
10. Choe, J.W., J.N. Calata, and G-Q. Lu, "Constrained-Film Sintering of a Gold Circuit Ink," J. Mater. Res., Vol. 10, No. 4 (1995), pp. 986-994.
11. Wang, T., G. Lei, G-Q. Lu, X. Chen, and L. Guido, "Improved Thermal Performance of High-Power LED by Using Low-temperature Sintered Chip Attachment," in 2009 ICEP-HDP, 2009, Beijing, China.
12. Liu, J.G., D. Xiong, and P. Panaccione, "Chip-on-Board Packaging and Thermal Solutions for 100W Single Large Area LED," in 5th International Conference and Exhibition on Device Packaging, 2009, Scottsdale/Fountain Hills, AZ.
13. Chen, X., R. Li, K. Qi, and G-Q. Lu, "Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste," J. of Electronic Materials, Vol. 37, No. 10 (2008), pp. 1574-1579.