SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 31, Issue 4, 2002, Pages 278-285

Zn-Al based alloys as Pb-free solders for die attach

(4) Rettenmayr, M a Lambracht, P a Kempf, B b Tschudin, C c

a DARMSTADT UNIVERSITY OF TECHNOLOGY (Germany)

b OMG AG and Co KG (Germany)

c ESEC Switzerland (Switzerland)

Author keywords

Liquid metal embrittlement; Pb free; Phase diagram; Segregation; Solder alloy

Indexed keywords

DIE CASTING; EMBRITTLEMENT; LIQUID METALS; METAL EXTRUSION; MICROSTRUCTURE; PHASE DIAGRAMS; SEGREGATION (METALLOGRAPHY); THERMODYNAMICS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY; ZINC ALLOYS;

DIE ATTACH;

SOLDERING ALLOYS;

EID: 0036540345 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-002-0144-1 Document Type: Article

Times cited : (108)

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