Development of high-temperature solders: Review

Microelectronics Reliability

Volumn 52, Issue 7, 2012, Pages 1306-1322

  Zeng, Guang ^a   McDonald, Stuart ^a   Nogita, Kazuhiro ^a  

^a UNIVERSITY OF QUEENSLAND   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE; LEAD-FREE SOLDER ALLOY; LEAD-FREE SOLDERING; SN-SB ALLOYS; SOLDERING APPLICATIONS;

ALLOYS; GERMANIUM; LEAD; SOLDERING; SOLDERING ALLOYS; TIN; ZINC;

TIN ALLOYS;

EID: 84861817834     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.02.018     Document Type: Review

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