MEMS reliability from a failure mechanisms perspective

Microelectronics Reliability

Volumn 43, Issue 7, 2003, Pages 1049-1060

  Van Spengen, W Merlijn ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DIELECTRIC DEVICES; ELECTRIC BREAKDOWN; THIN FILMS;

DIELECTRIC CHARGING;

MICROELECTROMECHANICAL DEVICES;

EID: 0038790007     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00119-7     Document Type: Conference Paper

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