Fracture strength and fatigue of polysilicon determined by a novel thermal actuator

IEEE Transactions on Electron Devices

Volumn 47, Issue 7, 2000, Pages 1522-1528

  Kapels, Hergen ^a   Aigner, Robert ^a   Binder, Josef ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b UNIVERSITY OF BREMEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; COMPRESSION TESTING; ELECTRIC HEATING; FATIGUE OF MATERIALS; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; SEMICONDUCTING SILICON COMPOUNDS; TENSILE TESTING; WEIBULL DISTRIBUTION;

BENDING TEST; POLYSILICON; THERMAL ACTUATOR; UNIAXIAL TENSION;

MICROACTUATORS;

EID: 0034229863     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/16.848302     Document Type: Article

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