Observations of low cycle fatigue of Al thin films for MEMS applications

Materials Research Society Symposium - Proceedings

Volumn 518, Issue , 1998, Pages 81-88

  Cornella, G ^a   Vinci, R P ^a   Suryanarayanan Iyer, R ^a   Dauskardt, R H ^a   Bravman, J C ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CREEP; DYNAMIC LOADS; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; MECHANICAL TESTING; METALLIC FILMS; MICROMACHINING; SCANNING ELECTRON MICROSCOPY; TEMPERATURE;

CYCLIC LOAD DISPLACEMENT BEHAVIOR; LOW CYCLE FATIGUE; MULTIPLE STEP TEST METHOD; TENSION TESTS;

MICROELECTROMECHANICAL DEVICES;

EID: 0032302943     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-518-81     Document Type: Conference Paper

References (7)