Wetting performance vs. board finish and flux for several Pb-FREE solder alloys

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2000, Pages 253-262

  Sattiraju, S V ^a   Johnson, R W ^a   Genc, D Z ^a   Bozack, M J ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; FINISHING; FLUXES; PRINTED CIRCUIT BOARDS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SOLDERING ALLOYS; WETTING; X RAY PHOTOELECTRON SPECTROSCOPY;

LEAD FREE SOLDER ALLOYS; ORGANIC SOLDERABLE PRESERVATIVE; REFLOW CYCLE;

PRINTED CIRCUIT MANUFACTURE;

EID: 0034449609     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. World environmental issues in electronics and the transition to lead-free
2. Soldering in electronics
3. Quantitative solderability measurement of electronic measurement of electronic components - Part 1: The wetting balance
4. Wetting performance of several Pb-free board finishes and solder alloys