Effect of substrate surface roughness on the wettability of Sn-Bi solders

Journal of Materials Science: Materials in Electronics

Volumn 11, Issue 4, 2000, Pages 279-283

  Chen, Yi Yu ^a   Duh, Jenq Gong ^a   Chiou, Bi Shiou ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CONTACT ANGLE; COPPER; EUTECTICS; POLISHING; POWDERS; SUBSTRATES; SURFACE ROUGHNESS; TIN ALLOYS; WETTING;

DYNAMIC CONTACT ANGLE ANALYZERS;

SOLDERING ALLOYS;

EID: 0034204577     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008917530144     Document Type: Article

References (21)

1. X. H. WANG and H. CONDRAD, Metall. Mater. Trans. A 26A (1995) 459.
2. H. K. KIM, H. K. LIOU and K. N. TU, J. Mater. Res. 10 (1995) 497.
3. X. B. ZHOU and J. TH. M. DE HOSSON, ibid. 10 (1995) 1984.
4. S. J. HITCHCOCK, N. T. CARROLL and M. G. NICHOLAS, J. Mater. Sci. 16 (1981) 714.
5. A. M. CAZABAT and M. A. COHEN STUART, J. Phys. Chem. 90 (1986) 5845.
6. R. N. WENZEL, Ind. Eng. Chem. 28 (1936) 988.
7. R. SHUTTLEWORTH and G. L. J. BAILEY, Disc. Faraday Soc. 3 (1948) 16.
8. R. H. DETTRE and R. E. JOHNSON, Ave. Chem. Ser. 43(1963) 112.
9. C. HUH and S. G. MASON, J. Colloid Interface Sci. 60(1977) 11.
10. J. D. EIK and R. J. GOOD, ibid. 53 (1975) 235.
11. M. G. NICHOLAS and R. M. CRISPIN, J. Mater. Sci. 21 (1986) 522.
12. X. B. ZHOU and J. TH. M. DEHOSSON, J. Mater. Res. 10(1995) 1984.
13. J. GLAZER, Int. Mater. Rev. 40 (1995) 65.
14. E. P. WOOD and K. L. NIMMO, J. Electron. Mater. 23 (1994) 709.
15. P. G. HARRIS and M. A. WHITMORE, Circuit World 19 (1993) 25.
16. M. MCCORMACK and S. JIN, J. Electron. Mater. 23 (1994) 635.
17. Y. Y. WEI and J. G. DUH, J. Mater. Sci., Mater. Electron. 9 (1998) 373.
18. Y. G. LEE and J. G. DUH, ibid. 10 (1999) 33.
19. E. I. STROMSWOLD, R. E. PRATT and D. J. QUESNEL, J. Electron. Mater. 23 (1994) 1047.
20. M. J. DE RUIJTER and J. DE CONINCK, Langmuir 13 (1997) 7293.
21. D. YAO and J. K. SHANG, IEEE Trans. Compon. Packaging, Manuf. Technol. Part B 19 (1996) 154.