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Volumn 38, Issue 11, 2009, Pages 2301-2307

Wetting properties and interfacial reactions of mechanically alloyed cu 5Zn 8-bearing pb-free solders on a copper substrate

(3) Jung, Inyu a Cho, Moon Gi a Lee, Hyuck Mo a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

Author keywords

Mechanical alloying (MA); Pb free solder; Wetting properties; Zn addition

Indexed keywords

BULK SOLDER; COPPER SUBSTRATES; CU SUBSTRATE; INDUCTIVELY COUPLED PLASMA ATOMIC EMISSION SPECTROSCOPY; INTERFACIAL REACTIONS; MECHANICALLY ALLOYED; MILLING TIME; PB FREE SOLDERS; PB-FREE SOLDER; ROTATIONAL SPEED; SOLDER ALLOYS; THERMODYNAMIC CALCULATIONS; WETTING ANGLE; WETTING PROPERTIES; WETTING PROPERTY; ZN ADDITION;

ALLOYING ELEMENTS; ATOMIC EMISSION SPECTROSCOPY; ATOMIC SPECTROSCOPY; BEARINGS (STRUCTURAL); COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; INDUCTIVELY COUPLED PLASMA; LEAD; MECHANICAL ALLOYING; MECHANICAL PROPERTIES; METALLURGY; POWDERS; SHEAR STRENGTH; SUBSTRATES; WETTING; ZINC;

SOLDERING ALLOYS;

EID: 70349881654 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0860-x Document Type: Article

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.