Viscosity and surface tension of liquid sn-cu lead-free solders

Journal of Electronic Materials

Volumn 38, Issue 6, 2009, Pages 828-833

  Zhao, N ^a   Pan, X M ^a   Yu, D Q ^b   Ma, H T ^a   Wang, L ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Lead free solder; Sn Cu alloy; Surface tension; Viscosity; Wetting property

Indexed keywords

ABSOLUTE TEMPERATURES; CU SUBSTRATE; HIGH TEMPERATURE; LEAD FREE SOLDERS; LEAD-FREE SOLDER; LINEAR FITTING; LIQUID STRUCTURES; LOW TEMPERATURES; METALLURGICAL REACTION; SN-CU ALLOY; SOLDER ALLOYS; TEMPERATURE RANGE; TEMPERATURE ZONE; TORSIONAL OSCILLATION; UNIT VOLUME; VISCOSITY VALUE; WETTING ANGLE; WETTING PROPERTY;

ACTIVATION ENERGY; ALLOYS; BRAZING; CAPILLARITY; COPPER ALLOYS; LEAD; LIQUIDS; SOLDERING ALLOYS; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACE TENSION; SURFACE WAVES; TIN ALLOYS; VISCOMETERS; VISCOSITY; WELDING; WETTING;

TIN;

EID: 67650436062     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0611-4     Document Type: Conference Paper

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