The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders

Journal of ASTM International

Volumn 7, Issue 7, 2010, Pages

  Lambrinou, Konstantina ^a   Engelmaier, Werner ^b  

^a IMEC   (Belgium)

^b Engelmaier Associates LC   (United States)

Author keywords

Ductile to brittle transition; Fractography; Fracture behavior; Lead free soldering; Solder joint reliability; Tin based solders

Indexed keywords

AMBIENT TEMPERATURES; APPLIED STRAIN; DIFFERENT SIZES; DUCTILE-TO-BRITTLE TRANSITION; EMBRITTLEMENT MECHANISMS; FRACTURE BEHAVIOR; FRACTURE SURFACES; INTER-METALLIC PARTICLE; LEAD FREE SOLDERS; LEAD-FREE SOLDERING; MECHANICAL CONSTRAINTS; MICROSTRUCTURAL ASPECTS; MICROSTRUCTURAL FEATURES; RECTANGULAR BEAMS; SOLDER JOINT RELIABILITY; SOLDER JOINTS; SOLDER MICROSTRUCTURE; SPATIAL DISTRIBUTION; SPECIMEN DIMENSION; TIN-LEAD SOLDERS; WORK FOCUS;

BRITTLE FRACTURE; CRYSTAL STRUCTURE; DUCTILE FRACTURE; DUCTILITY; FRACTOGRAPHY; FRACTURE MECHANICS; INTERMETALLICS; LEAD; MICROSTRUCTURAL EVOLUTION; SCANNING ELECTRON MICROSCOPY; SIZE DISTRIBUTION; SOLDERING; SOLDERING ALLOYS; STRAIN RATE; TITANIUM COMPOUNDS;

TIN;

EID: 77955807769     PISSN: None     EISSN: 1546962X     Source Type: Journal    
DOI: 10.1520/JAI103064     Document Type: Article

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