Microstructure evolution and shear strength of eutectic Sn-9Zn and Sn-0.7Cu lead-free BGA solder balls

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 47-51

  Wu, C M L ^a   Law, C M T ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BACKSCATTERING; ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; INTERMETALLICS; METALLIZING; MICROSTRUCTURE; PHASE DIAGRAMS; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH;

BALL GRID ARRAY (BGA); INTERMETALLIC LAYERS (IML); SOLDERABILITY; THERMAL AGING;

SOLDERING ALLOYS;

EID: 14844322363     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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